How fast can I get a first prototype on my bench?

FDM prototypes ship in 24–72 hours from a confirmed CAD. SLA, SLS and MJF parts ship in 3–5 days. Outdoor-grade PA12-CF prints typically land in a week.

What CAD formats do you accept for the customer board?

STEP (.step / .stp) is ideal. We also accept IGES, Fusion 360 (.f3d), Onshape exports, STL meshes, and dimensioned PDFs. A photo with a ruler is enough to start the conversation.

What tolerances and minimum wall thickness can you hold?

FDM: ±0.2 mm typical, 1.2 mm minimum walls. SLA: ±0.1 mm, 0.6 mm walls. SLS / MJF in PA12 or PA12-CF: ±0.15 mm, 0.8 mm walls and self-supporting geometry.

Can you actually deliver IP67 from a 3D-printed shell?

Yes — with the right polymer (PC, PA12-CF, ASA), a printed gasket groove and an O-ring or compression seal. We dunk-test every IP67 build at 1 m for 30 minutes and ship the result.

Who owns the enclosure CAD when the job is done?

You do. Every project runs under an NDA-by-default. We ship the STEP and STL on request and never touch your firmware, PCB layout, or BOM — only the box around them.

What batch sizes do you handle?

One unit to several thousand. We run prototype jobs on the same workflow as production batches — no tooling, no minimums, same printer fleet.

Do you ship internationally?

Yes — DAP or DDP, DHL Express or freight depending on volume. Standard transit to EU 1–2 days, US 2–3 days, APAC 3–5 days. Customs paperwork is included.

How many revision rounds are included?

Prototype tier includes one geometry revision. Pilot and Production tiers include unlimited revisions during the design phase — we lock the file together before any production print starts.

Can you provide material certificates and compliance docs?

Yes. Material data sheets, RoHS and REACH statements come standard. UL94 flame-rated polymers, FDA-compatible grades, and per-batch lot traceability are available on request.

We need a specific brand of MCU bay, screw, or insert. Will you accommodate?

Always. Standoff bosses, heat-set insert pockets, snap fits, sliding rails — we design around your hardware, not the other way around. Send the part numbers, we'll fit them.

3D-Printed IoT Enclosure Studio

IoT Enclosures. Engineered Around Your Hardware.

You bring the boards, sensors and batteries — we co-design the inside of the box with you and 3D-print it. Thermal-stable interiors, field-grade seams, real engineering on every layer. We don't touch your electronics; we make them survive the field.

See Inside the Box

48h: First print
IP67: Max seal
12+: Polymers

Scroll

8

Printers online

400×400×500

Max build (mm)

12+

Polymers stocked

48h

Avg first article

Inside the Box

The brainstorm that becomes the enclosure.

Before we print a single layer, we map every component of your hardware into the box. Hot zones, cold zones, antennas, cables, service access — all decided in CAD, with you.

Vented · Low-Power · Quiet · Typical IP40–IP54

Cool air enters at the base, warm air rises through lid slots. Zero moving parts. Best for indoor hubs, gateways, and edge nodes under ~5W.

1
MCU / SBC Bay
Standoff bosses sized to your board. Heat-set inserts on request.
2
Battery Compartment
Vented separator wall. Pressure-relief cutout in the floor.
3
TIM Contact Pillar
Printed pillar bridges hot chip → outer fins. The shell becomes the heatsink.
4
Printed Heatsink Fins
Fin geometry tuned to your thermal load (W) during CAD.
5
Antenna Window
Wall thinned to ≤1 mm; non-conductive zone, no metallic fasteners nearby.
6
Sensor Port
Sealed grommet pocket for external temp/humidity/probe lines.
7
Gasket Groove
Printed O-ring channel around the lid — IP65 to IP67 depending on profile.
8
Cable Strain Relief
Integrated comb + grommet pocket so connectors never pull on solder joints.

Hover any label · The cutaway adapts to the selected strategy

Thermal Engineering

The enclosure is the thermal system.

Every box we ship is designed around its thermal load. Material choice, internal layout, printed-in features, and a sim pass before the first layer prints.

Polymer Thermal Window

Material	Tg	Cont. Service	Thermal Cond.	Best For
PETG	80 °C	60 °C	0.20 W/mK	Indoor / short-term outdoor
ASA	100 °C	85 °C	0.17 W/mK	Long-term outdoor, UV-stable
PC	145 °C	120 °C	0.20 W/mK	High-impact / light-stable
PA12-CF	180 °C	130 °C	0.35 W/mK	Industrial / vibration
PEEK	143 °C	250 °C	0.29 W/mK	Aerospace / harsh chemistry

Approximate values for printed parts at typical infill. We pick the polymer to match your worst-case ambient + load.

Validation Loop

CAD → Sim → Print → Probe

Every enclosure goes through an FEA-lite thermal pass on the CAD before printing. We see hotspots before the first layer. Sample prints ship with optional thermocouple pockets so your team can verify in-field interior temperatures with a probe and a logger.

Feature · 01

Printed Heatsink Fins

Fin arrays printed into the lid or side wall — no aluminium bolt-on required.

Feature · 02

Convection Slots & Louvers

Geometry-tuned intake/exhaust patterns for natural chimney airflow.

Feature · 03

Internal Fan Ducts

A duct routes a customer-supplied 25/40/60 mm fan directly over the hot zone.

Feature · 04

TIM Contact Pillars

Printed pillar bridges the hot chip to the outer shell — the box becomes the heatsink.

Feature · 05

Hot/Cold Isolation Walls

Internal walls keep batteries and sensors out of the heat plume.

Feature · 06

PCM Cavities

Printed pockets for phase-change pouches absorb thermal spikes (cold-chain, burst loads).

Feature · 07

Labyrinth Seams

Stepped seam profiles for IP-rated convection housings without a gasket.

Feature · 08

Thermocouple Pockets

Sample prints with built-in probe ports so you can verify in-field temps.

Services

One studio. Every layer of the enclosure.

We print the box, not the electronics. So we obsess over the box.

01

Enclosure Co-Design

We sit with your BOM — boards, batteries, connectors, sensors — and CAD the housing around it. You keep your IP; we own the box.

02

Thermal-Aware Interior Layout

Hot zones isolated, cold zones ventilated, heat paths printed into the wall. We design the box to keep your electronics in spec.

03

Rapid Prototype Printing

FDM, SLA, SLS or MJF — first article on your bench in 24–72 hours. Iterate the geometry while your firmware team keeps shipping.

04

Production Runs & Post-Processing

Small-batch repeatable prints with vapor smoothing, painted finishes, heat-set inserts, gaskets and IP testing. Field-hardened, every unit.

Materials & Methods

The lab behind every enclosure.

Pick a process, polymer, or printed-in feature. The demo updates live.

The IoT-B Process

From your BOM to a finished enclosure — in days.

Six steps. No electronics work. Just the right box, built around your hardware.

STEP 01
Brief & BOM Intake
Send us board dimensions, connector list, thermal load in watts, IP target and environment. STL/STEP welcome but not required.
STEP 02
Interior Brainstorm
We map every component into the box — hot zones, cold zones, antenna windows, cable runs, service access.
STEP 03
CAD + Thermal Simulation
Parametric enclosure design with FEA-lite thermal passes. We see hotspots before the first layer prints.
STEP 04
Prototype Print + Fit Check
FDM, SLA, SLS or MJF first article in 24–72h. You drop your hardware in and confirm fit, fastener pull, port alignment.
STEP 05
Iterate (1–3 Cycles)
Geometry tweaks, gasket grooves, vent geometry, insert positions. Tight loops until the box is right.
STEP 06
Production Run + QA
1 to 1,000 units. Post-processed, gasket-fitted, IP-tested. Shipped with a measurement report per batch.

Pricing

Transparent bands. Quote in 24h.

No tooling fees, no minimums, no hidden NRE. You pay for design time, prints, post-processing, and testing — that's it.

Tier 01

Prototype

1–3 units · validate the geometry

from €240/ unit

5–7 day turnaround

CAD co-design session (60 min)
FEA-lite thermal pass
FDM / SLA first article
1 revision round included
STL/STEP files on request

Most picked

Tier 02

Pilot Batch

10–100 units · field-ready

from €58/ unit

2–3 week turnaround

Everything in Prototype
SLS / MJF / PA12-CF available
Vapor smoothing + heat-set inserts
Gasket fitting + IP54/IP65/IP67 test
Per-batch measurement report

Tier 03

Production

100+ units · dedicated slot

Volume quote

4 week SLA, recurring

Everything in Pilot Batch
Reserved print capacity
Serialization + batch traceability
Material cert on request (RoHS, REACH)
Logistics: DAP / DDP available

Prices indicative — final quote depends on volume, material, finish & IP test scope. NDA on request.

Showcase

Enclosures we've engineered.

Real boxes built around real customer hardware — each one solving a different thermal or environmental problem.

Why IoT-B

The enclosure studio that thinks about the inside first.

Thermal-aware design

Every enclosure starts with a hot/cold zone map and a thermal sim before geometry is locked.

Print-to-spec polymers

PETG, ASA, PC, PA12-CF, PEEK — the right plastic for your service temp, UV and chemical exposure.

No tooling, no minimums

Print one. Print a thousand. Same workflow, same week — no injection mold required.

You keep your electronics IP

We never touch your firmware or PCB. We design the box around it — your hardware stays yours.

Field-grade from day one

IP67 seams, vibration-damped mounts, UV-stable shells. Your prototype is your production part.

No vendor lock-in

We ship STL files on request. Your enclosure design is yours to keep, modify, or take elsewhere.

Illustrative Field Reports

What teams say about working with the studio.

The scenarios below are representative of the briefs we take on. Real customer references available on request, under NDA.

"We sent them our board dims and a thermal budget on Monday. By Friday the printed enclosure was on our bench with the fan duct already integrated. Throttling dropped from 18% to under 2%."

LV

Lena Voss

Hardware Lead, Volturn Robotics

"Their interior layout brainstorm uncovered an antenna shadow we'd missed. They re-zoned the box, thinned the wall over the radio, and our RSSI jumped 8 dB. They never touched the PCB — just the housing around it."

MK

Marco Kessler

Founder, Sentinel IoT

"We ship a cold-chain logger. IoT-B designed the printed cavity for our PCM pouches and the thermal mass curve held the interior 14°C below ambient for 8 hours of field testing. That's the entire product."

PA

Priya Anand

Industrial Automation, NorthFold

"Eighty IP67 housings, gasket-fitted, batch tested, delivered in three weeks. They sent us the STL with the order — no lock-in, no surprises. We keep iterating."

TA

Tomás Aguirre

CTO, AetherMesh

FAQ

The questions every engineer asks.

Lead time, tolerances, file formats, IP, ownership — the stuff that makes a project move.

Start the Build

Have hardware that needs a home?

Send your BOM. Get a sketched interior layout back within one business day.

hello@iot-b-ondemand.com